Digital Magazine

AWA Issues Agenda for Release Liner Event

AMSTERDAM, THE NETHERLANDS | AWA Alexander Watson Associates (AWA) announces the 2017 Global Release Liner Conference and Exhibition, which will focused on market growth, technology, and innovation. The event takes place March 29–31 in Chicago, IL.

The event will kick off with a full day’s forum on silicone, coating, and material technology chaired by Dr. Patti Hubbard, VP, R&D, for Avery Dennison Materials Group North America, including a panel discussion and two concurrent in-depth expert sessions examining developments in the different technology pathways—silicone and coating and materials.

On the following two days, the full conference agenda focuses on industry insights and takes a market and application “deep dive.” Chaired by Corey Reardon, president and CEO of AWA, the program features two keynotes. Michael Apperson, CEO of Loparex, will examine the current state of the industry and where it goes from here. David Silverstein, CEO of business strategy consultants BMGI, will look at ways to anticipate technology trends to create competitive advantage, manage new product development, and protect intellectual property rights.

Also featured will be market statistics and trends in pulp and paper; how to drive value through M&A activity by Bill Hornell of Mesirow; and specific trends in resin and film raw materials/silicone raw materials.

The next day’s agenda features overviews of major market sectors today for release liner—automotive and aerospace (from 3M and consumer electronics (from Avery Dennison). The program also looks at the demands made by composites on substrates and liners in a presentation from Web Industries and one from FLEXcon on release liner in the digital age of print and production.

Sustainability is becoming a major focus in the industry, and the issues and opportunities it represents will be discussed in full.

The conference will include a supplier tabletop exhibition as well as the presentation of the AWA Release Liner Industry Leadership Award.

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