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Neo-Bonding

Glue Dots Intl., New Berlin, WI, says its p-s MatrX, designed for use in industrial packaging applications, is a faster, easier, and safer method of substrate-to-substrate bonding. New technology consists of a pattern of adhesive micro-dots and comes in widths of ¼ in. and ½ in. Thicknesses range from 5-15 mils. Product is available in both permanent and removable formulas, providing optimum strength for long-lasting attachment, yet minimal but effective for quick-release applications.

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