Barrier Packaging Seminar

PRESS RELEASE

VALENCIA, VENEZUELA—LatinPack and Tecniproyectos RG announce the 4th edition in Latin America of the international "Barrier Packaging—Technologies and Applications" seminar, to be held November 14-15, 2006, at Camara de Industriales in Venezuela. The seminar will cover all polymeric materials involved in barrier packaging (their chemical structure and functionality), principles on permeability concepts in plastics, fabrication systems and troubleshooting (coextrusion, extrusion coating, lamination, metallization, etc.), design of multilayer structures for food packaging, and future market trends in equipment and barrier materials.

Registration is $275 by November 7, $300 after. Visit latinpack.net.



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