Flex-Pack Summit

Published: February 01, 2009

Norcross, Ga | TAPPI PLACE announces the 2009 Flexible Packaging Summit, to be held in Columbus, OH, April 28-30. Included will be the two-day Consumer Packaging Solutions for Barrier Performance Course, featuring roundtable discussions with industry celebrities, interactive study sessions, and expert speakers. Keynote presentations will be given by Ken Laverdure, Packaging R&D, Sustainability and Advanced Materials Group, Frito-Lay North America, and Dan Feldmeier, senior associate principal engineer, Kraft Food/Oscar Mayer. The event also offers the Symposium on Nanomaterials for Flexible Packaging, covering nano barrier enhancement, the impact of antimicrobial nanotechnologies, the impact of active packaging, integrating intelligent packaging nanotechnologies with biodegradable films and food packages, as well as issues, challenges, and the future of nanomaterials for flexible packaging. For more information visit www.tappi.org.