Aicomp Summit 2024 – Event for the Digitalization of the Packaging Industry
- Published: October 12, 2023
New IT-innovations in the packaging industry at Aicomp’s hybrid event
At the 2024 Aicomp Summit, the latest technical developments and insights in the field of software for the packaging industry will be presented in lectures and technical workshops. This information is relevant for both packaging manufacturers and digitalization partners.
While the Aicomp Summit 2021 and 2022 could only be conducted virtually due to the pandemic, the 2024 event will take place for the first time as a hybrid event, at the nhow Hotel Berlin. February 14-15, 2024, interested parties will learn more about topics of digitalization in the packaging industry.
In 2021, the internationally renowned IT company Aicomp launched the first Aicomp Summit Event. This event offers various stakeholders in the IT and packaging industry, with a focus on the packaging sector, to participate in an event that focuses on the joint exchange of new technologies and ways to increase the efficiency of industrial processes. In this way, Aicomp pursues the goal of sustainably shaping the future of the packaging industry through innovation and optimization.
The events will focus on the Aicomp's latest developments, which are meant to meet the challenges of advancing digitalization and the expectations of customers. The key focus will be on topics in product configuration and how this enables optimization in all areas of a business operation. In addition, completely new technological approaches, such as machine learning and cloud-based SaaS solutions for data management and enterprise control, will be explained and discussed in detail.
Aicomp is focused on continuously expanding its partner network and therefore brings together numerous partner companies to present relevant solution approaches at the Summit. Among the partners represented are well-known companies such as Esko, T. CON, SAP, OMP, and Ortec.
These partners will present their latest technologies and solution approaches to meet the specific needs of the packaging industry. Esko will offer insights into the latest developments of their CAD suite. T.CON and OMP will focus on optimizing production planning, while Ortec will present important innovations in their solution for efficient transport planning. SAP, as the largest European software group, will focus on the innovations in their diverse product portfolio.
Other participants include renowned Aicomp customers such as Mondi, Saica, RKW, the MM Group, and the Mayer Group, who will share their extensive experience in digitalization with the attendees. These companies will present their digitalization strategies and development approaches in a vivid way and provide exciting insight into their processes for tackling the day-to-day challenges of their industry.
The Summit is an English-moderated event open to all interested parties after prior registration. In addition, the event will be available via livestream, and individual presentations will be available on the website and can be accessed after logging in.
Registrater at https://summit.aicomp.com/ for both online access and for the live event on site in Berlin.
