- July 08, 2009
Norcross, GA | TAPPI invites all industry professionals to participate in the 2010 PLACE Conference Technical Program, April 18-21, 2010, in Albuquerque, NM. Sponsored by TAPPI’s Polymers, Laminations, Adhesives, Coatings and Extrusions (PLACE) Div., this conference is tailored for attendees from all areas of the flexible packaging and converting industries.
Key topics for the 2010 conference include advances in materials and equipment; product design innovations; new applications and how these relate to product end use; and additional proposed topics.
Individuals interested in presenting at the conference should complete the Abstract Submittal Form located online before August 10, 2009. Opportunities are available for individual papers, panel discussions, tutorials, and workshop sessions.
The peer-review of all submissions will take place in late August, and feedback will be provided to authors shortly thereafter. Final papers will be due in February 2010.