- July 02, 2008
CRYSTAL LAKE, IL | Changes in scheduling for the 2009 IADD/FSEA Odyssey, to be held May 6-9, 2009, in Atlanta, GA, will afford attendees and exhibitors alike the opportunity to experience a wide variety of classroom and TechShop™ educational sessions, with even more time to gather valuable information on industry trends in the Exhibition Hall.
Sponsored by the International Assn. of Diecutting & Diemaking (IADD) and the Foil Stamping & Embossing Assn. (FSEA), the three-day event at the Cobb Galleria is targeted specifically to die-cutting, diemaking, foil stamping/embossing, and many other trade finishing processes.
Changes also are in store for the increasingly popular TechShop sessions, a unique set of workshops where technical challenges are tackled on-press in a production-like environment. Advancements in audio-visual and high-speed camera equipment promise to heighten the real-time action in these ‘live’ workshops to a new level.
Organizers say that these enhancements to the overall format of the 2009 Odyssey will provide a better opportunity for attendees to explore the vast array of new technologies showcased in the exhibition hall.
“Already, we are at 75 percent capacity for exhibit space—a record for one year from the event,” reported Odyssey Exhibit Coordinator Sue Corcoran. “We expect to showcase more machinery in production at this show than at any other Odyssey in the past. This is a strong indication of the value—to both exhibitor and attendee—this growing event continues to offer.” For more information, visit: www.iadd.org/odyssey