- September 01, 2010
Technomelt Supra Cool 130 packaging adhesive reportedly offers benefits that include high bond strength, thermal stability, and flowability, as well as a broad application spectrum, all at a processing temperature of 130 deg C in the melter. The technology also helps manufacturers improve the sustainability performance of their lines, since the high quality reduces scrap rates and bonding failures. This reduces costs for waste disposal and repackaging. Lower processing temperature makes it possible to cut energy consumption by up to 40%.