- July 25, 2006, pffc-online.com
The TAPPI PLACE conference will take place September 17-21, 2006, at the Hyatt Regency in Cincinnati, OH. It will showcase innovations in materials, equipment, and processes in the flexible packaging and converting industry. Attendees will learn about:
- New developments in flexible packaging, barrier films, sealant films, adhesives, coatings, additives, and resins.
- Latest developments in polymer extrusion, adhesive laminating, and coating equipment design.
- Cost-reduction opportunities and equipment advances.
- How advances in packaging technology have been applied in manufacturing process improvement.
Visit tappiplace.org for more information.