- July 15, 2013
DÜSSELDORF, GERMANY | Henkel announces Technomelt Supra 100 Cool hot melt adhesive with an application temperature of 100 deg C, said to deliver high efficiency in packaging production while promoting sustainability in customer operations. Company says trials have demonstrated that the low application temperature of the adhesive reduces the energy requirement compared to conventional hot melts by up to 50%.
Suitable for application in the food industry, product is said to offer good heat resistance and cold flexibility, enabling its use for both warm-filling and deep-freeze applications. Company says the low application temperature also means faster applicator startup and reduces the amount of wear and tear to which machine components and applicators are subjected.