Bobst Gears Up for IADD FSEA Odyssey

PRESS RELEASE

ROSELAND, NJ—Bobst Group North America will exhibit the latest in diecutting, foil stamping, and folding/gluing technologies at the IADD FSEA Odyssey in Milwaukee, WI. During the May 2-4, 2007, event, Bobst will exhibit the SPanthera 106-LER diecutter, SP 102-BMA Foilmaster, and the Mistral 110 A-2 folder/gluer.

Bobst representatives and equipment also will participate in the training sessions held throughout the three-day event, including:

  • "Designing for Folding and Gluing Success," in which Bobst Group North America, PCR technical service manager Yvan Magni will discuss how to improve folder/gluer productivity by starting upstream.
  • Efficient Setup on Multi-Up Foil Stamping Jobs," which will feature the Bobst SP 102-BMA Foilstamper.
  • "Blanking, Nicking, and Rubbering," featureing the Bobst SPanthera 106-LER diecutter.
Bobst will perform live demonstrations of state-of-the-art diecutting, hot-foil stamping, embossing, folding, and gluing technologies. See bobstgroup.com.

Subscribe to PFFC's EClips Newsletter