Featured Stories
Show Preview | SVC TechCon 2018 Targets Thin Films
The Society of Vacuum Coaters draws industry professionals, engineers, academics, and scientists to its annual conference and expo.
Read moreSleeve Label Awards | AWA Confers 4 with Top Honors
AWA Alexander Watson Assoc. bestows awards on four winners of its annual Sleeve Label Competition.
Read moreShow Preview | INFOFLEX 2018 Collocates with Forum in Indianapolis
More than 240 exhibitors from every facet of the package printing [ampersand] converting industries will meet more than 2000 attendees.
Read moreCoating Matters | The 6 C's of Roll-to-Roll Coating Systems
Develop a balanced approach to precision coating by understanding these six areas of concentration.
Read more•
•
•
•
News | New Products
-
Testing Machines Inc. Enhances COF Tester
The 32-76e COF tester now offers peel capabilities as well as other new features
-
Acucote Expands UV Inkjet Line
The company is now offering permanents, removables, and blockout adhesives, and has more additions planned
-
CCL Industries Acquires Imprint Plus
The bolt-on acquisition for Avery adds the manufacture of badges, signs, and more to CCL’s portfolio
-
BillerudKorsnas Launches Climate-Positive Packaging
D-Sack cement bag dissolves in cement mixer
-
Bobst Lyon Reports Expansion
The company is expanding its factory in France and will open a new Competence Center in 2018 to aid machinery development as well as service
-
Contact Originators Offers Wide Plate for Corrugated
The 2.8-mm-wide flexo plate reportedly allows corrugated printers to maximize their print yields
-
Smart Planet Technologies Starts Paper Cup Recycling Program
With support from Allan Company & Replenysh, company says reCUP Recycling Initiative takes a major step addressing global paper cup recycling problem
White Papers
• Designing a Successful Retort-Grade Packaging Structure
• Hermetic-Seal Performance of BOPP Laminate Structures in VFFS Pouch Applications
• Methods and Design Considerations for the Application of Hot Melt Coatings
• BOPP Laminate Structures for “Over-the-Mountain” VFFS Pouch Applications
Expert Advice
Is P&G’s New Freshies Packaging a Good Idea?
Innovation Station Archive Jackie Marolda's Bio
Brand Reputation on the Line?
Marketing Mojo Archive Stephanie Millman's Bio
OMET Partners with Clemson's Sonoco
- Published: May 01, 2009
Lecco, Italy | OMET S.r.l. has formed a partnership with Clemson Univ.'s new Sonoco Inst. of Packaging Design and Graphics. The emphasis will be on printed electronics, and the hope is that Clemson will be able to break new ground in this emerging market.
OMET has donated a Varyflex press to be used by students for R&D, industry activities, and for OMET customer demonstrations. The narrow web press features seven printing stations that can be configured with rotary screen, flexography, or gravure, with a variety of solvent-based, water-based, and UV-curable ink systems. It can handle polymer substrates as thin as 12 microns or paperboard materials as heavy as 600 microns, while achieving high-end registration through a complete servo-controlled system.
Find more news at www.pffc-online.com
What's happening at your company? Send your news to This email address is being protected from spambots. You need JavaScript enabled to view it..